Products

Unitile's Steel Cementitious Flange Panels (600mm X 600mm) are non-combustible in nature and are coated with electrostatic epoxy paint. These panels consist of flat steel top sheet resistance welded to a formed steel bottom sheet, which is in filled with a lightweight proprietary cementitious mixture. Uniquely designed hemispherical reinforcing pockets on the underside enhance structural strength and deliver ultimate durability and acoustic performance

The cantilever edges of the panel are reduced and this unique product design enhances the technical performance of the system, reduces the risk of damage at site and aims to provide tremendous advantages to the user with respect to handling of panels and ease of installation during the construction program. Available in Corner Lock and Edge Support Rigid Grid System. Top performance finish in Bare and Carpet shade are available.

Top performance finish in Bare and Carpet shade are available. Top performance finish in Bare and Carpet shade is available.Unitile latest generation of access floor panels designed using the all new folded flange technology to guarantee a squeak free floor for our users.Unitile’s Unifold Access Floor Panels are non-combustible in nature and are coated with electrostatic epoxy paint. These panels consist of flat steel top sheet resistance welded to a formed steel bottom sheet, which is in filled with a lightweight proprietary cementitious mixture. Uniquely designed hemispherical reinforcing pockets on the underside enhance structural strength and deliver ultimate durability and acoustic performance.

The uniqueness of this panel design is it engineered folded edges along the perimeter of the panel, which eliminates damage to the panel edges. Its wider beam width not only enhances the load carrying performance of the system but also provides a squeak free floor.

Unitile's Chipboard Encapsulated Access Floor Panel consists of engineered 600mm square modular panels constructed around a high density E1 grade chipboard core. The core is fully encapsulated with GI on all six sides in a special mechanical interlocking of the top & bottom GI tray. This double folded lock constructs into a panel that has a unique in-built stringer at the underside of each panel edge. This unique engineering exhibits fine dimensional tolerances for modular control, accurate alignment of grids & inter-changeability of panels that complies with the Euro Class requirement of EN 12825.

Unitile's Chip Board Non Encapsulated Panel consists of engineered 600mm square modular panels constructed around a high density E1 grade chipboard core. The system fully complies with the Euro Class requirement of EN 12825.The base and the top surface of the core is factory bonded using an appropriate combination of surface finishes such as Aluminum, Galvanized sheet steel, High Pressure Laminate etc. The surface coverings are trimmed to ensure fine dimensional control, accurate alignment of grids and inter-changeability of panels. A full depth ABS edge band provides total encapsulation of the chipboard core and also protects the edge of the surface covering to prevent ingress of moisture.

Electrical continuity is maintained through the top and bottom surface of the panel on to the pedestal head through conductive gasket. This ensures positive positioning and location of the floor panel on to the understructure system.

ings in new raised floor cutouts require sealing before installation of communications or power cabling. Integral grommet is equipped to effectively address this concern in the most reliable manner. As per estimates comprehended at multiple data centers, unsealed floor ings prevent close to 48% of conditioned air from having access to IT equipment. Loss of air in this manner generally termed as bypass airflow results in IT equipment hot spots, cooling unit inadequacies and mounting infrastructure costs. U-Flex products are designed as the perfect solution to discourage bypass airflow and its consequences with respect to data center cooling.

Seals ings in raised floor cutouts already installed where communications or power cabling have been established previously. Floor ings, if left , generally obstruct 48% of conditioned air from reaching IT equipment. Loss of air in this manner generally termed as bypass airflow results in IT equipment hot spots, cooling unit inadequacies and mounting infrastructure costs. Products designed by U-Flex restrict this bypass airflow and minimize negative effects on data center cooling.

Used to seal different types of raised floor tile cutouts. It also facilitates the desired flexibility needed for removing tiles without the risk of cables getting entangled. Floor ings, if left , generally obstruct 48% of conditioned air from reaching IT equipment. Loss of air in this manner generally termed as bypass airflow results in IT equipment hot spots, cooling unit inadequacies and mounting infrastructure costs. Products designed by U-Flex restrict this bypass airflow and minimize negative effects on data center cooling.

Surface Mount large grommet has larger sealing capacities. It acts as a closure for different types of raised floor tile cutouts already in use at premises and facilitates the desired flexibility needed for removing tiles without the risk of cables getting entangled.

Surface Mount large grommet has larger sealing capacities. It acts as a closure for different types of raised floor tile cutouts already in use at premises and facilitates the desired flexibility needed for removing tiles without the risk of cables getting entangled.

Ideal to be used for sealing a wide variety of new as well as existing ings . It also provide the flexibility to seal huge ings (e.g. those under PDUs). As per measurements taken at various data centers, as much as 60% of conditioned air cannot reach the air intake of IT equipment due to uncapped floor ings. Loss of air in this manner generally termed as bypass airflow results in IT equipment hot spots, cooling unit inadequacies and mounting infrastructure costs. Products designed by U-Flex restrict this bypass airflow and minimize negative effects on data center cooling.

Ideal to be used for sealing a wide variety of new as well as existing ings . It also provide the flexibility to seal huge ings (e.g. those under PDUs). As per measurements taken at various data centers, as much as 60% of conditioned air cannot reach the air intake of IT equipment due to uncapped floor ings. Loss of air in this manner generally termed as bypass airflow results in IT equipment hot spots, cooling unit inadequacies and mounting infrastructure costs. Products designed by U-Flex restrict this bypass airflow and minimize negative effects on data center cooling.

Its function is to seal ings in new as well as existing raised floor cutouts to control bypass airflow and maximize cooling system efficiency. The 3″ Round Grommet features Brush Technology that defines its image as a premium solution for your data center. This innovative sealing technology cut down costly bypass airflow down to bare minimum, increases usable cooling unit capacity and maximizes efficiency from HVAC equipment.

Its function is to seal ings in new as well as existing raised floor cutouts to control bypass airflow and maximize cooling system efficiency. The 4″ Round Grommet features Brush Technology that defines its image as a premium solution for your data center. This innovative sealing technology cut down costly bypass airflow down to bare minimum, increases usable cooling unit capacity and maximizes efficiency from HVAC equipment.